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Wafer-dicing San Francisco

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Thermocarbon in San Francisco

1354 Greenwich St, San Francisco, 94109
(650) 968-0570

Thermocarbon offers ultra-thin dicing blades and dicing saws for wafer slicing of thin silicon materials for fiber optics and semiconductors or cutting heavy substrates such as ceramics and quartz.

advanced material dicing, diacut, diamond blade, diamond blades

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