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Wafer-dicing Phoenix

1 results for Wafer-dicing

Flipchip International in Phoenix

3701 E University Dr, Phoenix, 85034
(602) 431-6020

FlipChip International is a world leading WLCSP bumping supplier, with wafer dicing and thinning capabilities, ASIC, ASPP and ASSP design, and a complete IC service from design to packaging.

bga, bare die, csp, flip chip bga

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The results list for wafer-dicing in Phoenix. You can find the best wafer-dicing vendors and providers in Phoenix in the Phoenix Business Directory. Currently there is one company registered in the Phoenix business directory under wafer-dicing.

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